The IMAPS/ACerS 15th International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT 2019), co-organized by the Shanghai Institute of Ceramics, Chinese Academy of Sciences (SICCAS) and Tsinghua University, was successfully held from April 16^th to 19^th, 2019 in Shanghai, China. Prof. Yongxiang Li from SICCAS and Prof. Ji Zhou, academician of Chinese Academy of Engineering from School of Materials Science and Engineering of Tsinghua University were the co-chairmen of the conference. Nearly 200 experts, researchers and entrepreneurs in relevant fields from 15 countries and regions, including China, the United States, Germany, Japan, Korea, the United Kingdom, Austria, Australia, Finland, Portugal, Russia, etc, attended the conference. A small exhibition was also held in the meantime.

Prof. Yongxiang Li presided over the opening ceremony. Prof. Lixin Song, the director of SICCAS, and Prof. Xi Yao, academician of Chinese Academy of Sciences from Tongji University, delivered the welcome speeches respectively. Prof. Ji Zhou chaired the plenary talk.

The conference covered 9 subjects: Microwave dielectric materials and their applications, LTCC/ULTCC materials and their applications, Piezoelectric materials and their applications, Functional materials for passive/active devices, Materials processing/device manufacturing, Devices designing, modeling and simulation, Materials and devices characterization and reliability, 3D printing and their applications and New devices/components for emerging applications.

Over 100 presentations are delivered during the conference, including five plenary talks given by Dr. Sebastian Brunner from Qualcomm Austria RFFE GmbH, Dr. Michael Badding from Corning Incorporated, Dr. Takahiro Takada from Marata Manufacturing Co., Ltd, Professor  Jau-Ho Jean and Xiaohui Wang from Tsinghua University.

In addition, a lab tour of SICCAS was organized. The attendees visited the laboratories engaged in BGO crystals , thermoelectric materials and devices, dye sentisized solar cells, passive integrated devices and materials, etc.

The CICMT is an annual international conference jointly hosted by the International Society for Microelectronics Assembly and Packaging (IMAPS) and the American Ceramic Society (ACerS). It is a professional international conference combining electronic ceramic technology and microelectronic packaging technology. The conference focuses on the frontiers of disciplines, new technologies and applications researches, and has significant international influence in the field of microelectronics technology and high-frequency communication new technologies. It has been held round in the United States-Japan-Europe for 14 times.

CICMT 2019 is the first time of the CICMT series conference to have been held in China. It established a platform for communication and exchange for the researchers in the related field, and played an important role in promoting the development of China and the global ceramic interconnects and ceramic microsystems technology.

Prof. Lixin Song, the director of SICCAS delivered the welcome speech

Prof. Xi Yao, academician of Chinese Academy of Sciences from Tongji University delivered the welcome speech

Prof. Ji Zhou, academician of Chinese Academy of Engineering from School of Materials Science and Engineering of Tsinghua University chaired the plenary talk

Prof. Yongxiang Li from SICCAS presided over the opening ceremony

IMAPS/ACerS 15th International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT 2019)